Agilent acquires semiconductor device manufacturer Axellion

Reading: On December 1, 2011, Agilent Technologies (NYSE:A) and Accelicon announced that they have signed a final purchase agreement. This transaction is expected to be completed within 60 to 90 days. The acquisition, led by Agilent EEsof EDA, will further strengthen Agilent’s leadership in semiconductor device modeling.

US time On December 1, 2011, Agilent Technologies Inc. (NYSE:A) and Accelicon announced that they have signed a final purchase agreement. This transaction is expected to be completed within 60 to 90 days. The relevant financial details were not disclosed.

The acquisition, led by Agilent EEsof EDA, will further strengthen Agilent’s leadership in semiconductor device modeling. With higher operating frequencies, smaller technology nodes, new materials and device layouts requiring more accurate process design packages, accurate and validated device models play an important role in reducing development cycles. As a result, device modeling continues to be one of the most critical parts of the entire electronic design process.

"With the introduction of innovative technologies and excellent teams from Excel, we look forward to providing customers with a broader portfolio of products to meet their different modeling needs," said Mark Pierpont, Agilent vice president and general manager of SMS. Combining Agilent's experience in measurement with the expertise of the two companies in modeling can advance our goal to provide the circuit designer's industry's most complete process from device modeling to simulation and measurement."

Akselli sells the industry's leading SPICE model analysis solution for model quality verification. Axelelli's MQA solution serves as the industry's first model verification platform, providing a critical link between foundry and design companies by comparing, documenting, and validating models provided by foundries. Users can evaluate the differences between different technology nodes, model library versions, and even different foundry models. Aikesaili also provided a modeling platform, MBP, which allows modeling engineers to optimize the SPICE model library to more realistically reflect the data of the chip and meet specific types of design requirements.

"We look forward to the entire team joining Agilent's EEsof department," said Tim Kek, chief executive of Axellion. Smith said, "Using Agilent's world-class on-site and engineering resources will enhance Ixelles' development and support on modeling and verification platforms. The combination of EEsof and the Ixelles platform will provide the most comprehensive on the market today. The most advanced product."

Most of the employees of Ikesseli work in Beijing. After completing this acquisition, Agilent’s device modeling, R&D, and services will be expanded in Asia with a growing number of top chip foundries.